Technology Capability Data
With our advanced technology we... (read more)
Blind vias are used to connect one outer layer with at least one inner layer. The holes for each connection level must be defined as a separate drill file. The ratio of drill diameter to hole depth (aspect ratio) must be 1:1 or larger to provide a consistent amount of plating down the hole. The smallest hole determines the depth and thus the max. distance between the outer layer and the corresponding inner layers.
Buried vias are used to create... (read more)
Buried vias are used to create connections of the inner layers similar to blind vias do but they have no contact with the outer layers so they are hidden as the name suggests. The holes for each connection level must be defined as a separate drill file. The ratio of drill diameter to hole depth, which is also known as aspect ratio must be 16:1 or smaller. The smallest hole determines the depth and therefore the max. distance between the respective inner layers.
Copper Filled Vias
Copper-filled vias are... (read more)
Copper-filled vias are vias that are filled with either pure copper or epoxy resin with copper. This copper fill enhances the conductivity and stability of the via, helping it to more effectively transfer signals from one side of the board to the other.
Resin Filled Vias
Via Fill is a technique used... (read more)
Via Fill is a technique used to selectively and completely close via holes with the most common type of via fill which is non-conductive epoxy. It is vacuumed into the blind or through holes via an automated squeegee machine. The epoxy is then baked and planarized flat to leave a surface where the holes are now hidden.
Some key benefits of via filling are:
- More reliable surface mounts
- Increased assembly yields
- Improved reliability by decreasing the probability of trapped air or liquids.
Blind and Buried Vias can also be resin filled.
In the plugged vias process... (read more)
In the plugged vias process, vias are plugged with solder mask or other non-conductive inks. LPI solder mask is then applied over the plug.
Plugged vias IPC-4761 (Type iii, iv, v & vi)
These tie in with the process of... (read more)
These tie in with the process of all types resin filled vias. The vias are resin filled and then have a plated layer of copper over the top which is known as the capping process which hides the hole and means there is no chance of chemistry or solder going down the barrel of the hole.
Capped Vias IPC-4761 (Type vii)