Please view our latest products and capabilities. The information provided should be used as a guide and in dialogue with our Design for manufacture team, to check if your combination is compatible. Please contact our Sales team for up-to-date capabilities.
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Manufacturing Capabilities
Capability | Standard Production | Advanced Capability |
---|---|---|
Maximum Production Panel Size | 610 x 457 mm | 610 x 533 mm |
Board Thickness | 0.25 mm to 5.50 mm Scored:- 0.30 mm to 3.2 mm | 0.10 mm to 5.50 mm Scored:- 0.30 mm to 3.2 mm |
Minimum Aspect Ratio | Through Hole:- 10 : 1 Blind Hole:- 1 : 1 | Through Hole:- 16 : 1 Blind Hole:- 1 : 1 |
Multilayer | Maximum:- 24 layers | Maximum:- 48 layers |
Core Thickness | Minimum:- 0.05 mm Maximum:- 2.40 mm | Minimum:- 0.05 mm Maximum:- 5.5 mm |
Copper Thickness | Inner:- 18 µm | 35 µm | 50µm Outer:- 12 µm | 18 µm | 35 µm | 70 µm | 105 µm | Other thicknesses available on request |
Copper Plating | Minimum:- 25 µm Maximum:- 50 µm | Minimum:- 25 µm Maximum:- 210 µm |
Conductor Width / Spacing | Minimum:- 0.075 mm / 0.075 mm | Minimum:- 0.050 mm / 0.050 mm |
Annular Ring | Minimum above finished hole size: 0.075mm | Minimum above finished hole size: 0.075mm |
Inner Layer Clearances | Minimum clearance from copper plane to plated or non-plated hole: 0.3mm | Minimum clearance from copper plane to plated or non-plated hole: 0.3mm |
Profile Clearances | Minimum clearance from copper plane to circuit profile (Routed): 0.25mm Minimum clearance from copper plane to score centre line: 0.5mm | Minimum clearance from copper plane to circuit profile (Routed): 0.25mm Minimum clearance from copper plane to score centre line: 0.5mm |
Product Range
Circuit Board | Description |
---|---|
Rigid | Multilayer, Double and Single sided |
Mixed Composite Multilayer Rigid | Mixed material builds |
Polyimide | Advanced material with exceptional thermal and dielectric properties |
PTFE | Advanced material with outstanding dielectric properties used for RF/Microwave applications |
Insulated Metal Substrates (IMS) | Materials designed to aid heat dissapation |
Flex | Multilayer, Double and Single sided |
Flex Rigid | PCBs with both Flex and Rigid elements |
Sculptured Flex | PCBs consisting of flexible circuit boards with varying thicknesses (can include assembly of rigid components) |
Surface Mount Interconnects (SMI) | A robust, flexible board-to-board interconnection solution utilising industry standard manufacturing equipment |
Technology
Technology | Description |
---|---|
Blind Vias | Drilled holes within a multilayer PCB connecting the outer layer to one or more inner layers |
Buried Vias | Drilled holes within a multilayer PCB connecting inner layers |
Copper-Filled Vias | Drilled holes within a multilayer PCB connecting the outer layer to one or more inner layers, filled with copper for enhanced conductivity |
Resin-Filled and Plugged vias | IPC types III, IV, V and VI |
Capped Vias | Resin filled and plated over (IPC type VII) |
Surface Finishes
Metal Finish | In-House / Sub-Contract | Typical Thickness |
---|---|---|
Electroless Nickel Immersion Gold (ENIG) | In-House | Ni 4µm – 6µm Au 0.05µm – 0.1µm |
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) | In-House / Sub-Contract | Ni 3µm – 5µm Pd 0.1µm – 0.5µm Au 0.025µm – 0.05µm |
Electroplate Gold (Hard) Over Nickel | In-House | Ni 1.0 - 6.0µm Au 1.0µm – 3.0µm |
Electroless Gold (Soft) Direct Over Copper | In-House | Au 0.05µm – 1.0µm |
Immersion Silver | In-House | 0.1µm – 0.25µm |
Immersion Tin | Sub-Contract | Sn 1.0µm – 1.1µm |
Hot Air Solder Level (HASL) | In-House | 10µm – 25µm |
Lead-Free Hot Air Solder Level | In-House | 10µm – 25µm |
Organic Solderability Preservative (OSP) | In-House | 0.2µm |
Silver Ink | In-House | |
Carbon Ink | In-House | |
Solder Mask | In-House | Range of colours and finishes available |