Board Material Capability Data



FR4 Board
High Speed Laminate Board
PTFE Board
Rigid Polyimide
Flex Material Board
Sculptured Flex Board
IMS Board

FR4 Laminate

F R 4 Board Material for PCB

Description

A typical FR4 board consists of a glass-reinforced epoxy resin base material laminated between two thin layers of copper, providing a cost-effective solution for PCB manufacture. This material has become the industry standard for most PCB’s today... (read more)

We use established providers for FR4 board base materials, which include:

  • EMC
  • ​Ventec
  • Isola
  • Kingboard

There are several variants of FR4 board depending on the application.

FR4 excluding copper is used for insulation layers and board supports.

  • Glass-reinforced epoxy resin base material without the laminated copper. designed for use in insulation plates, templates, board supports, etc. They are manufactured using Gerber type mechanical drawings or DXF files.
  • Typical thickness from 0.3 to 5 mm.

Resources

High Speed Laminate

(HSD)

Circuit Board Holding Image

Description

With technology requirements increasing at a rate akin to that of Moore's law, Printed Circuit Board (PCB) manufacturers are seeing an ever-growing demand for high-speed capable laminate circuits for use in High-Speed Digital (HSD) applications... (read more)

These complex boards consist of many different specialist components or methods such as ultra-dense resin to reduce impedance, cross-weave copper traces to improve resonance strength, or treated and processed copper foils to further reduce resistance.

The key aim for processes employed here is to reduce signal loss over the length of the board which is necessary for many HSD applications where data transfer is typically in the gigabytes. Getting the balance right is crucial in order to provide the best value. Selected methods are employed to improve signal strength across a PCB, and our design team will assess the suitable options which are job specification dependant.

We use many established providers for HSD board base materials, which include:

  • EMC
  • ​Isola
  • Rogers
  • Ventec

 

Resources

PolyTetraFluoroEthylene Laminate

(PTFE)

Circuit Board Holding Image

Description

Polytetrafluoroethylene (PTFE) is a synthetic fluoropolymer of tetrafluoroethylene that has numerous applications. The largest attraction for use within the PCB industry is that PTFE has outstanding dielectric properties for RF/Microwave PCB laminate material... (read more)

We use many established providers for PTFE board base materials, which include:

  • Arlon
  • ​Nelco
  • Rogers
  • Taconic

 

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Polyimide

Circuit Board Holding Image

Description

Polyimide is a specialist material which is used widely in military and aerospace markets. Polyimide is a high reliability material and runs at much higher temperatures than the normal FR4 boards... (read more)

We use many established providers for rigid polyimide board base materials, which include:

  • Arlon (85N and 35N/33N)
  • Ventec (VT901)

 

Resources

Flex Materials

Circuit Board Holding Image

Description

Our flexible Printed Circuit Boards (PCB's) are... (read more)

Our flexible Printed Circuit Boards (PCB’s) are typically manufactured using a combination of polyimide and a high temperature thermo-setting resin. This provides a flexible circuit with excellent mechanical, chemical and electrical properties, which is resilient to a broad range of temperatures. Polyimide is capable of withstanding temperatures over 400°C. With the adhesive, the continious operating temperature is 150°C (maximum short duration temperature of 300°C).

Other features include: low thermal expansion rate; high tensile strength; cross-laminate compatibility, all of which optimally facilitate rigid/flexible combinations and multilayer applications using both plated-through-hole and clearance layer techniques.

While Polyimide is the default material which meets the majority of PCB medical, military, automotive, technology and aerospace requirements, alternative materials available include Polyethylene Naphthalate (PEN) or Polyester (PET), normally used for low end commercial applications as they have a much lower melting point.

We use many established providers for flex board base materials, which include:

  • Ventec (Polyimide Thin Flex)
  • ​CCI (Dupont Pyralux)

The most commonly used thicknesses are 25 microns (0.001″) and 50 microns (0.002″); other thicknesses are available. Flame retardent versions are also available. Please discuss with our sales team for specific requirements.

Resources

Sculptured Flex Materials

Circuit Board Holding Image

Description

Sculptured flex boards offer many of the characteristics... (read more)

Sculptured flex boards offer many of the characteristics described in the flex material board section with the addition of a 0.2mm copper centre, insulated with polyimide, which is selectively reduced in thickness using a chemical ‘milling’ process to enhance flexibility and rigidity. This allows for extremely accurate and high-capacity current-carrying features.

Sculptured circuits have long been incorporated in applications ranging from cellular phones to missiles as a reliable and cost effective interconnection solution, and are regularly adopted within military (defence), aerospace, medical, industrial, computer, automotive, and instrumentation & telecom markets.

We use many established providers for flex board base materials, which include:

  • MSC Polymer (Copper)
  • ​Ventec (Polyimide Thin Flex)
  • ​CCI (Dupont Pyralux)

The most commonly used thicknesses are 20 microns (0.001″) and 50 microns (0.0008″); other thicknesses are available. Falme retardent versions are also available. Please discuss with our sales team for specific requirements.

Resources

Insulated Metal Substrate Laminate

(IMS)

Circuit Board Holding Image

Description

Insulated Metal Substrate (IMS) board material caters for advanced board production where board components require additional heat dissipation over regular FR4 boards (up to 10x better). Typical examples include the automotive industry: LED components; engine management boards; DC power supply modules and relays... (read more)

This is done by adding an extra insulation layer, usually polymer or ceramic, between the copper and the board to spread and dissipate heat with improved efficiency.

We use many established providers for FR4 board base materials, which include:

  • ​Bergquist
  • CCI
  • Rogers
  • Ventec

 

Resources