Manufacturing Capability Data



Dimensions

Layers

Technical

Panel Sizes

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Description

Our panels are processed in... (Read More)

Our panels are processed in set board sizes (tyipcally our standard board) by our engineers according to job specification and circuit board size.

The ultimate aim is to fit as many Printed Circuit Boards (PCBs) as possible into each panel to keep the overall cost down.

Specifications:

  • Largest Standard Production Panel Size: 610mm x 457mm (other sizes are available)

Our engineers will calculate each board size based on job specification.

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Board Thickness

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Description

PCB thickness depends on... (read more)

Printed circuit board thickness depends on the application of the PCB, how many layers it has and the build of the PCB.

Standard Production Thickness Capability: 0.25mm to 5.50mm

Advanced Production Thickness Capability: 610mm to 457mm

 

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Aspect Ratios and Smallest Hole Size

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Description

Aspect ratio is defined by the proportional... (read more)

The smallest plated hole size manufacturable will depend on the aspect ratio, defined as the ratio of overall board thickness to hole size.  The higher the ratio the more difficult the hole will be to plate. Our standard Maximum aspect ratio of plated through holes is 10:1, 16:1 for advanced production. The maximum aspect ratio for blind holes is 1:1 or 1.2:1 for advanced production. Higher aspect ratios are available from specialist Offshore partners.

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Maximum Number of Layers

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Description

With more than two layers, these PCB's... (read more)

The maximum number of layers for a standard production is 24 whilst for advanced production is 48.  Higher layer counts are available from specialist Offshore partners.

 

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Core Thickness

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Description

Typical core thickness can range from... (read more)

PCB cores are made up of a copper plated glass reinforced epoxy laminate sheet however there are more advanced cores made of PTFE, ceramic and polyimide for different applications. The thickness of the cores can range from 0.05mm to 2.4mm. prepreg is the common term for a reinforcing fabric which has been pre-impregnated with a resin. This resin system which is typically epoxy already includes the proper curing agent.

Specifications:

  • Standard Production: between 0.05mm and 2.4mm
  • Advanced Production: between 0.05mm and 5.5mm

 

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Copper Plating

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Description

What is it and what does it do?

When copper plating it is done through a process called electroplating. This means than the panels themselves act at cathodes and the copper balls in baskets are the anodes to make a electrical connection. We can plate the hole walls due to the graphite or electroless copper we have put there already. This then makes the electrical connection. The copper surface is cleaned and activated in a number of baths before being electroplated. To ensure good conductivity through the holes we need to plate an average of approximately 25 microns of copper on the hole walls (18 µm copper is the defined minimum in the IPC 600J-Class 2 standard).  This means that we also plate typically 25 microns on the surface tracks.

Specifications:

  • Typical Standard Production: between 25µm and 50µm
  • Typical Advanced Production: up to 210µm

 

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Conductor Width and Spacing

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Description

Conductor width and spacing depend... (read more)

The minimum conduction width and spacing, also know as Track and Gap. will depend on the thickness (height) of the track.  

Specifications:

  • Standard Copper Thickness: 0.075mm / 0.075mm
  • Advanced Copper Thickness: 0.05mm / 0.050mm

 

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Annular Ring

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Description

The annular ring is the copper pad... (read more)

The annular ring is the area of copper pad around a drilled and finished hole. All around the hole there should be enough copper to form a solid connection between the copper traces and the via. Therefore, the main purpose of an annular ring is to establish a good connection between a via and a copper trace. We can produce an annular ring down to 50um or 2thou. We can also produce a barrel plated hole which has an annular ring on one side only but connects traces from top to bottom.

Specifications:

  • Standard Inner Layer: From 0.075mm
  • Standard Outer Layer: From 0.075mm
  • Advanced Inner Layer: From 0.050mm
  • Advanced Outer Layer: From 0.050mm

nb: minimum annular ring size must exceed the finished hole size

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Inner Layer Clearances

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Description

An inner layer clearance is the minimum... (read more)

An inner layer clearance is the minimum distance from the edge of a hole to any adjacent, unconnected or inner layer copper feature. The larger the clearance the better chance that the drilled hole wont cause shorts. 

Specifications:

  • Typical Minimum Clearance: 0.3mm from copper plane to non-plated hole
  • Typical Minimum Clearance: 0.3mm from copper plane to copper-plated hole

nb: design and production panel dependant

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Profile Clearances

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Description

Special features in a PCB board include... (read more)

Specifications:

  • Standard Minimum Clearance: 0.50mm from copper plane to score centre line
  • Advanced Minimum Clearance: 0.20mm from copper plane to circuit profile
  • Typical Advanced Minimum Clearance: 0.30mm from copper plane to score centre line
  • Advanced Minimum Hole Diameter: 0.075mm for blind vias only

 

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