Manufacturing Capability Data



Dimensions

Layers

Technical

Panel Sizes

panel sizes

Description

Standard Production Maximum Panel Size: 610mm x 457mm

Advanced Production Maximum Panel Size: 610mm x 533mm

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Board Thickness

Thickness

Description

Printed circuit board thickness depends on the application of the PCB, how many layers it has and the build of the PCB.

Standard Production Thickness Capability: 0.25mm to 3.2mm

Advanced Production Thickness Capability: 0.10mm to 5.50mm

 

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Aspect Ratios and Smallest Hole Size

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Description

The smallest plated hole size manufacturable will depend on the aspect ratio, defined as the ratio of overall board thickness to hole size. The higher the ratio the more difficult the hole will be to plate.

Our standard Maximum aspect ratio of plated through holes is 10:1, 16:1 for advanced production. The maximum aspect ratio for blind holes is 1:1 or 1.2:1 for advanced production. Higher aspect ratios are available from specialist Offshore partners.

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Maximum Number of Layers

Layers

Description

Resources

The maximum number of layers for a standard production is 24 whilst for advanced production is 48.  Higher layer counts are available from specialist Offshore partners.

 

Core Thickness

core thickness

Description

PCB cores are made up of a copper plated glass reinforced epoxy laminate sheet however there are more advanced cores made of PTFE, ceramic and polyimide for different applications. The thickness of the cores can range from 0.05mm to 2.4mm. prepreg is the common term for a reinforcing fabric which has been pre-impregnated with a resin. This resin system which is typically epoxy already includes the proper curing agent.

Specifications:

  • Standard Production: between 0.05mm and 2.4mm

  • Advanced Production: between 0.05mm and 5.5mm

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Copper Plating

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Description

Copper plating is done through a process called electroplating. This means than the panels themselves act at cathodes and the copper balls in baskets are the anodes to make a electrical connection. We can plate the hole walls due to the graphite or electroless copper we have put there already. This then makes the electrical connection. The copper surface is cleaned and activated in a number of baths before being electroplated. To ensure good conductivity through the holes we need to plate an average of approximately 25 microns of copper on the hole walls (18 µm copper is the defined minimum in the IPC 600J-Class 2 standard).  This means that we also plate typically 25 microns on the surface tracks.

Specifications:

  • Typical Standard Production: between 25µm and 50µm

  • Typical Advanced Production: up to 210µm

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Conductor Width and Spacing

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Description

The minimum conduction width and spacing, also know as Track and Gap. will depend on the thickness (height) of the track.

Specifications for standard copper thickness:

  • Minimum track and gap for Standard production: 0.075mm (3 thou)
  • Minimum track and gap for Advanced production 0.05mm (2 thou)

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Annular Ring

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Description

The annular ring is the area of copper pad around a drilled and finished hole. All around the hole there should be enough copper to form a solid connection between the copper traces and the via. Therefore, the main purpose of an annular ring is to establish a good connection between a via and a copper trace. We can produce an annular ring down to 50um or 2thou. We can also produce a barrel plated hole which has an annular ring on one side only but connects traces from top to bottom.

Specifications:

  • Standard Inner Layer: From 0.075mm
  • Standard Outer Layer: From 0.075mm
  • Advanced Inner Layer: From 0.050mm
  • Advanced Outer Layer: From 0.050mm

nb: minimum annular ring size must exceed the finished hole size

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Inner Layer Clearances

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Description

An inner layer clearance is the minimum distance from the edge of a hole to any adjacent, unconnected or inner layer copper feature. The larger the clearance the better chance that the drilled hole wont cause shorts. 

Specifications:

  • Typical Minimum Clearance: 0.3mm from copper plane to non-plated hole
  • Typical Minimum Clearance: 0.3mm from copper plane to copper-plated hole

nb: design and production panel dependant

Resources

Profile Clearances

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Description

Specifications:

Standard Production Minimum Clearance (Routed) 0.25mm

Standard Production Minimum Clearance (Scored) 0.50mm

Advanced Production Minimum Clearance (Routed) 0.20mm

Advanced Production Minimum Clearance (Scored) 0.30mm

Resources